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Nokia - Oracle TEST

Sr Principal TIA Designer

Posted One Month Ago
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Remote or Hybrid
Hiring Remotely in United States
Senior level
Remote or Hybrid
Hiring Remotely in United States
Senior level
Leads architecture, transistor-level design, simulation, verification, silicon bring-up, and characterization of ultra-high-speed Transimpedance Amplifiers for coherent optical and PAM4 applications. Designs broadband analog circuits and supporting functions such as AGC loops, CTLEs, regulators, bandgaps, and converter interfaces. Drives package and system integration, technical reviews, documentation, methodology improvements, and mentorship of junior designers.
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Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will lead the design of multi-tens of GHz Transimpedance Amplifiers (TIAs) for coherent long-haul, metro, and PAM4 data center applications, leveraging cutting-edge SiGe BiCMOS and CMOS technologies. You'll play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers, telecommunications networks, and emerging AI-driven infrastructure.


NION2026

Responsibilities
  • Lead the architecture, design, simulation, verification, and silicon bring-up of ultra-high-speed Transimpedance Amplifiers (TIAs) for coherent optical and PAM4 data center applications. 

  • Translate system and chip-level requirements into robust analog circuit architectures and detailed transistor-level designs. 

  • Design and optimize low-noise, high-linearity broadband analog circuits for optical receiver front ends. 

  • Develop and validate supporting analog functions, including AGC loops, CTLEs, voltage regulators, bandgaps, and data converter interfaces. 

  • Drive package and system-level integration, ensuring optimal signal integrity and performance. 

  • Perform silicon characterization, debug, and correlation of measurement results against simulation models. 

  • Collaborate closely with layout, system, DSP, packaging, and product engineering teams throughout the development cycle. 

  • Lead technical reviews, contribute to design methodology improvements, and ensure successful first-pass silicon execution. 

  • Mentor and guide junior analog designers, fostering technical excellence within the team. 

  • Create and maintain high-quality technical documentation, design reports, and specifications.

Qualifications
  • Extensive experience designing high-speed TIAs for coherent optical communication systems and/or PAM4 data center transceivers. 
  • Strong expertise in analog and mixed-signal IC design using SiGe BiCMOS and CMOS technologies. 
  • Deep understanding of transistor-level circuit design, device physics, noise analysis, and feedback/control loop stability. 
  • Proven experience in one or more of the following areas: 
    • Optical receiver front-end design
    • AGC loop implementation
    • CTLE design
    • High-precision analog circuits (bandgaps, regulators, ADC/DAC interfaces)
    • Package and system-level integration
  • Proficiency with industry-standard EDA tools, custom analog layout techniques, and electromagnetic (EM) simulation tools. 
  • Demonstrated success delivering silicon from concept through production. 
  • Hands-on experience with lab measurement, debugging, and performance validation of high-speed ICs. 
  • Strong leadership, problem-solving, communication, and collaboration skills. 
  • Ability to work effectively in a fast-paced, multidisciplinary global engineering environment.

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