IC Package Design Researcher

Identify, integrate, and qualify novel materials into advanced microelectronics packages (e.g., dielectrics, interconnects, adhesives, TIMs, etc.). 

Drive package and test fixture design from architecture planning to CAD generation to system level validation, including mechanical, thermal, electrical, and optical design and accelerated reliability testing. 

Plan and execute material and package characterization and failure analysis. 

Collaborate with OSATs, Foundries, and material suppliers to validate new process flows and materials and identify and resolve failure mechanisms. 

Build data-backed acceptance criteria for novel materials and correlate lab measurements with modeling results to inform design trade-offs. 

M.S. or Ph.D in Materials Science/Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry or a related field, with 5+ years in microelectronics packaging. 

Hands-on experience with at least some of the following tools for package and system design (e.g., Cadence Allegro, Xpedition, Altium) and mechanical/thermal/EM simulation (e.g. Creo/Solidworks, Ansys Mechanical, FloTHERM/Icepak, HFSS, CST). 

Proficiency in characterization methods and failure analysis (Radiography, RF S-parameters, optical insertion loss, DMA/TMA, SEM, AFM, etc.) 

Experience with wafer-level and substrate fabrication processes and the ability to identify and de-risk new processes. 

Strong cross-functional collaboration and communication skills, with the ability to translate complex experimental data into clear design and process recommendations for both technical and non-technical stakeholders.