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Nokia - Oracle TEST

Senior Mechanical Packaging Engineer

Posted 9 Hours Ago
Be an Early Applicant
Remote or Hybrid
Hiring Remotely in United States
Senior level
Remote or Hybrid
Hiring Remotely in United States
Senior level
Lead mechanical development of electro-optic modules, integrating Silicon Photonics based optical transceivers, and innovating designs while ensuring manufacturing and cost targets are met.
The summary above was generated by AI

As part of Nokia’s Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia’s Photonic Service Engines, from inception stage to New Product Introduction.
 

Responsibilities
  • Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
  • Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets.
  • Drive key technology development to enable next generation product design.
  • Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software.
  • Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses.
  • Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products.
  • Plan and Drive prototype assembly builds to enable deliveries for early design validation.
  • Drive package debug activities during product validation and qualification.
  • Survey new materials and vendors for all Advanced Packaging activities.
  • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
Qualifications

You have:

  • Advanced Degree in Mechanical Engineering or similar field.
  • 5-8 years of extended experience in high-volume packaging of 2.5/3D packages.
  • Expertise in next generation advanced photonics packaging technologies.
  • Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software.
  • Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software.
  • Experience with package and process design/development from design to production.
  • Expertise in material properties and yield/failure mode analysis.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
  • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
  • Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis.
  • Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc. 
     

It would be nice if you also have:

  • Experience in optical coupling design and assembly for optical engines.
  • Experience in multilayer material bonding and heterogeneous integration.
  • Experience in high-speed signal integrity design and analysis.
About Us
Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. 

Learn more about life at Nokia.


Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia. 

About the Team
Some of our benefits in US:
  • Corporate Retirement Savings Plan
  • Health and dental benefits
  • Short-term disability, and long-term disability
  • Life insurance, and AD&D – Company paid 2x base pay
  • Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
  • Paid time off for holidays and Vacation
  • Employee Stock Purchase Plan
  • Tuition Assistance Plan
  • Adoption assistance
  • Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.


Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.

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