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Nokia - Oracle TEST

Principal PIC Simulation Engineer

Posted 10 Hours Ago
Be an Early Applicant
In-Office or Remote
Hiring Remotely in United States
Expert/Leader
In-Office or Remote
Hiring Remotely in United States
Expert/Leader
The Principal PIC Simulation Engineer leads technical efforts in photonic integrated circuits, focusing on materials characterization, simulation, and opto-electronic testing while guiding cross-functional teams and providing strategic technical direction.
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As a Principal PIC Simulation, Materials and Device Characterization Engineer, you will serve as a technical authority within Nokia’s Optical Components organization, responsible for deep technical leadership in photonic integrated circuit (PIC) device physics, materials characterization, simulation, and opto‑electronic testing.

This role focuses on understanding, modeling, and characterizing materials and devices for advanced optoelectronic applications, enabling root‑cause identification and guiding corrective actions across design, process, and manufacturing teams. You will operate with a high degree of autonomy, influence cross‑functional engineering direction, and contribute directly to the success of Nokia’s next‑generation optical component technologies.


NION2026

Responsibilities

PIC Device Physics, Simulation & Modeling

  • Act as a subject matter expert in PIC device physics, guiding design and technology decisions
  • Develop, apply, and correlate device and material simulation models to experimental and manufacturing data
  • Work effectively with simulation packages, scripting environments, and large data sets to extract insight and guide technical direction
  • Partner with device design, process, and product engineering teams to translate modeling and characterization results into actionable improvements

Materials & Device Characterization

  • Lead materials characterization across semiconductor, metal, and dielectric layers, including interpretation of complex physical and electrical data
  • Drive opto‑electronic testing and characterization of PIC devices, correlating performance to material properties and processing conditions
  • Establish characterization methodologies and best practices to support technology development, yield improvement, and reliability objectives

Root Cause Analysis & Corrective Action

  • Drive root cause analysis of complex materials, device, and performance issues using data‑driven and physics‑based approaches
  • Define and implement corrective actions, working across design, process, integration, and manufacturing teams
  • Translate characterization and modeling results into clear technical recommendations and risk assessments

Technical Leadership & Cross‑Functional Influence

  • Provide technical leadership at the Principal level, influencing strategy and technical direction beyond immediate project scope
  • Drive cross‑functional teams of engineers toward shared technical objectives
  • Mentor and guide engineers across levels, elevating overall organizational capability in simulation, materials, and device understanding
  • Communicate complex technical findings clearly to engineering, management, and business stakeholders
Qualifications
  • Ph.D. in Electrical Engineering, Physics, or a related field
  • Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications
  • Deep expertise in: 
    • PIC device physics
    • Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation
    • Opto‑electronic testing of PIC devices
    • Modeling, simulation, scripting, and working with large, complex data sets
    • Physics‑based and data‑driven root cause analysis
  • Demonstrated ability to drive cross‑functional engineering teams to measurable outcomes
  • Excellent communication and organizational skills

Preferred Qualifications

  • Experience supporting technology development, qualification, and yield ramp for photonic devices
  • Strong background correlating simulation, materials characterization, and manufacturing data
  • Experience influencing technical direction across geographically distributed teams
  • Track record of solving complex, multidisciplinary problems in optoelectronics or compound semiconductor technologies

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