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Nokia - Oracle TEST

Optoelectronics ASIC Researcher

Posted 9 Days Ago
Be an Early Applicant
In-Office or Remote
Hiring Remotely in United States
Senior level
In-Office or Remote
Hiring Remotely in United States
Senior level
Lead research and development of optoelectronic ASICs and integrated subsystems for high-speed optical networks. Translate architectures to transistor-level schematics and layouts, characterize ICs with high-frequency test methods, integrate ICs with photonic circuits, and present research at conferences while collaborating across multidisciplinary teams.
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The Integrated Circuits & Microsystems Research Lab at Bell Labs is looking for a talented Opto-electronics ASIC Researcher. You will perform leading research and development in the design and characterization of optoelectronic interfaces and integrated subsystems for high-speed optical networks. You will drive research into novel integration techniques, integrated circuit architectures, and optoelectronic interfaces to push the boundaries of performance and efficiency.

Responsibilities
  • Work closely with Nokia Bell Labs researchers and business units to identify key technologies for optical sub-systems.
  • Translate ASIC architectures into transistor-level circuit schematics and layouts, including driver/modulator and photodiode/TIA interconnects.
  • Characterize manufactured ICs using high-frequency test & measurement techniques and wireline modulation formats.
  • Collaborate on the assembly and integration of ICs with photonic integrated circuits.
  • Document and present research outcomes to internal and external audiences, including travel to international conferences.
  • Drive research into novel integration techniques and circuit architectures.
  • Push the boundaries of performance and efficiency in high-speed optical networks.
  • Maintain strong interpersonal skills and collaborate effectively with a multi-disciplinary team.
Qualifications
  • Ph.D. in Electrical Engineering or Physics (or Master's with 5+ years' experience) is required.
  • Proven track record of successful tape-outs in state-of-the-art semiconductor technologies, preferably SiGe BiCMOS.
  • Strong technical writing and communication skills are essential.
  • Experience in designing and characterizing high-speed analog and mixed-signal wireline circuits.
  • Proficiency in industry-standard IC toolchains, such as Cadence Virtuoso & EMX, Keysight ADS, and Ansys HFSS.
  • Hands-on experience with high-frequency test & measurement equipment is a must.
  • Experience with ultra-high signal frequencies (100 GHz+) is desirable.
  • Knowledge of semiconductor fabrication processes, IC packaging, and microelectronics assembly is a plus.
  • Skills in system modeling or digital signal processing for wireline communications are advantageous.
  • Design experience or knowledge of photonic integrated circuit components is preferred.

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